Variable resistance memory programming

ABSTRACT

Some embodiments include a device having memory elements and methods of storing information into the memory elements. Such methods can include increasing a temperature of a portion of a memory element for a time interval during an operation to change a resistance state of the memory element. After the time interval, the methods can include decreasing the temperature of the portion of the memory element. Decreasing the temperature can be performed using a signal having a first negative slope and a second negative slope. Other embodiments are described.

BACKGROUND

Computers and other electronic products (e.g., digital televisions,digital cameras, and cellular phones) often have memory devices withmemory cells to store information. Some memory devices may storeinformation having a value based on a resistance value of a memoryelement of the memory cell. The resistance value in the memory elementof these memory devices may change over time. Thus, the reliability ofthe information stored in the memory cell may be degraded.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a block diagram of a memory device having a memory arraywith memory cells, according to an embodiment of the invention.

FIG. 2 show a partial block diagram of a memory device having a memoryarray including phase change memory cells with access components andmemory elements, according to an embodiment of the invention.

FIG. 3 through FIG. 5 show schematic diagrams of examples of differentmemory cells having different access components coupled to memoryelements, according to various embodiments of the invention.

FIG. 6 through FIG. 9 show a memory cell having a memory elementconfigured to have various resistance states corresponding to variousresistance values, according to various embodiments of the invention.

FIG. 10 is a chart showing example resistance values and correspondingexample resistance values of the memory element of FIG. 6 through FIG.9, according to various embodiments of the invention.

FIG. 11 through FIG. 14 show a memory cell having a memory element andan access component arranged in a stack, according to variousembodiments of the invention.

FIG. 15 is a graph of temperature versus time during a programmingoperation to reset a memory cell, according to an embodiment of theinvention.

FIG. 16 is a graph of amplitude versus time of a signal that can be usedduring the programming operation associated with FIG. 15, according toan embodiment of the invention.

FIG. 17 is a graph of temperature versus time during a programmingoperation to set a memory element of a memory cell, according to anembodiment of the invention.

FIG. 18 is a graph of amplitude versus time of a signal that can be usedduring the programming operation associated with FIG. 17, according toan embodiment of the invention.

FIG. 19 is a graph showing a signal having multiple pulses used during aprogramming operation, according to an embodiment of the invention.

FIG. 20 is a flow diagram showing methods of programming a memorydevice, according to an embodiment of the invention.

DETAILED DESCRIPTION

FIG. 1 shows a block diagram of a memory device 101 having a memoryarray 102 with memory cells 100, according to an embodiment of theinvention. Memory cells 100 can be arranged in rows and columns alongwith lines 104 (e.g., wordlines having signals WL0 through WLm) andlines 106 (e.g., bit lines having signals BL0 through BLn). Memorydevice 101 can use lines 104 and lines 106 to transfer information withmemory cells 100. Row decoder 107 and column decoder 108 decode addresssignals A0 through AX on lines 109 (e.g., address lines) to determinewhich memory cells 100 are to be accessed. A sense amplifier circuit 110operates to determine the value of information read from memory cells100 and provide the information in the form of signals to lines 106.Sense amplifier circuit 110 can also use the signals on lines 106 todetermine the value of information to be written to memory cells 100.Memory device 101 includes circuitry 112 to transfer information betweenmemory array 102 and lines (e.g., data lines) 105. Signals DQ0 throughDQN on lines 105 can represent information read from or written intomemory cells 100. Lines 105 can include nodes within memory device 101or pins (or solder balls) on a package where memory device 101 canreside. Other devices external to memory device 101 (e.g., a memorycontroller or a processor) can communicate with memory device 101through lines 105, 109, and 120.

Memory device 101 can perform memory operations such as a read operationto read information from memory cells 100 and a programming operation(sometime referred to as write operation) to program (e.g., write)information into memory cells 100. A memory control unit 118 controlsthe memory operations based on control signals on lines 120. Examples ofthe control signals on lines 120 can include one or more clock signalsand other signals to indicate which operation (e.g., a programming orread operation) memory device 101 can perform. Other devices external tomemory device 101 (e.g., a processor or a memory controller) can controlthe values of the control signals on lines 120. Specific values of acombination of the signals on lines 120 can produce a command (e.g.,programming or read command) that can cause memory device 101 to performa corresponding memory operation (e.g., programming or read operation).

Each of memory cells 100 can be programmed to store informationrepresenting a value of a single bit or a value of multiple bits such astwo, three, four, or another number of bits. For example, each of memorycells 100 can be programmed to store information representing a binaryvalue “0” or “1” of a single bit. The single bit per cell is sometimescalled a single level cell. In another example, each of memory cells 100can be programmed to store information representing a value of multiplebits, such as one of four possible values “00”, “01”, “10”, and “11” oftwo bits, one of eight possible values “000”, “001”, “010”, “011”,“100”, “101”, “110” and “111”, or one of other values of another numberof multiple bits. The multiple bit per cell is sometimes called amultilevel cell.

Memory device 101 can receive a supply voltage, including supply voltagesignals Vcc and Vss, on lines 130 and 132, respectively. Supply voltagesignal Vss can operate at a ground potential (e.g., having a value ofapproximately zero volts). Supply voltage signal Vcc can include anexternal voltage supplied to memory device 101 from an external powersource such as a battery or an alternating-current to direct-current(AC-DC) converter circuitry.

Circuitry 112 of memory device 101 can include a select circuit 115 andan input/output (I/O) circuit 116. Select circuit 115 can respond tosignals SEL1 through SELn to select the signals on lines 106 and 113that can represent the information read from or programmed into memorycells 100. Column decoder 108 can selectively activate the SEL1 throughSELn signals based on the A0 through AX address signals on lines 109.Select circuit 115 can select the signals on lines 106 and 113 toprovide communication between memory array 102 and I/O circuit 116during read and programming operations.

Memory device 101 can include a non-volatile memory device and memorycells 100 can include non-volatile memory cells such that memory cells100 can retain information stored thereon when power (e.g., Vcc, Vss, orboth) is disconnected from memory device 101. Each of memory cells 100can include a memory element having a material in which at least aportion (e.g., a programmable portion) of the material can be programmedto cause the portion to change between different phases, such as betweena crystalline phase (which is sometimes referred to as a crystallinestate) and an amorphous phase (which is sometimes referred to as anamorphous state). Each of memory cells 100 can have a resistance statecorresponding to a resistance value when the memory cell is programmed.Different resistance values can represent different values ofinformation programmed in each of memory cells 100.

Memory device 101 can perform a programming operation when it receives(e.g., from an external processor or a memory controller) a programmingcommand and value of information to be programmed into one or moreselected memory cells among memory cells 100. Based on the value of theinformation, memory device 101 can program the selected memory cells tocause them to have appropriate resistance values to represent the valuesof the information.

Memory device 101 can include a storage area 144 to store programmingparameter values and selectively use these values during a programmingoperation. Memory device 101 can store the programming parameter values(e.g., in the form of a table 155 in storage area 144). The programmingparameter values can include different amplitude values of electricalpulses of signals used during a programming operation. The amplitudevalues can correspond to voltage amplitude values (e.g., in volt units)or current amplitude values (e.g., in ampere units) of one pulse ormultiple pulses to be used in a programming operation. The programmingparameter values can also include values for time intervals associatedwith pulse segments of the pulses of the signals. The values for thetime intervals can include a rise time value (in time unit such asnanosecond) and fall time value of the pulse segments of a pulse.

One skilled in the art may recognize that memory device 101 may includeother components that are not shown to help focus on the embodimentsdescribed herein.

Memory device 101 may include devices, memory cells, and programmingoperations similar to or identical to those described below withreference to FIG. 2 through FIG. 20.

FIG. 2 shows a partial block diagram of a memory device 201 having amemory array 202 including phase change memory cells 200 with accesscomponents 211 and memory elements 222, according to an embodiment ofthe invention. Memory array 202 can correspond to memory array 102 ofFIG. 1. As shown in FIG. 2, memory cells 200 can be arranged in rows230, 231, and 232 along with lines (which can conduct signals such assignals WL0, WL1, and WL2) and columns 240, 241, and 242 along withlines (which can conduct signals such as signals BL0, BL1, and BL2).Access components 211 can turn on (e.g., by using appropriate values ofsignals WL0, WL1, and WL2) to allow access to memory elements 222 toread information from or program (e.g., write) information into memoryelements 222. Programming information into memory elements 222 caninclude causing the memory elements to have specific target resistancevalue. Read information from memory elements 222 can include measuring aresistance value of memory elements 222.

FIG. 3 through FIG. 5 show schematic diagrams of examples of differentmemory cells 300, 400, and 500 having different access components 311,411, and 511 coupled to memory elements 333, 444, and 555, according tovarious embodiments of the invention. Lines (which can conduct signalssuch as signals WL and BL) in FIG. 3 through FIG. 5 can correspond toone of lines 104 and one of lines 106 of FIG. 1, respectively. FIG. 3through FIG. 5 show examples of access components 311, 411, and 511including a metal-oxide-semiconductor field-effect transistor (MOSFET),a bipolar junction transistor (BJT), and a diode, respectively. Memorycells 300, 400, and 500 can include other types of access components.

As shown in FIG. 3 through FIG. 5, each of memory elements 333, 444, and555 can couple between two electrodes, such as electrodes 351 and 352(FIG. 3), electrodes 451 and 452 (FIG. 4), or electrodes 551 and 552(FIG. 5). FIG. 3 through FIG. 5 schematically show electrodes 351, 352,451, 452, 551, and 552 as dots. Structurally, each of these electrodescan include a conductive material, and the memory element (333, 444, or555) can include a variable resistance material. The variable resistancematerial can include a phase change material. As shown in FIG. 3 throughFIG. 5, access components 311, 411, and 511 can enable signals (e.g.,voltage or current) to be transferred to and from memory elements 333,444, and 555 via electrodes 351, 352, 451, 452, 551, and 552 duringoperations, such as read and programming operations.

Each memory cell 200 can have an on-state and an off-state. Aprogramming operation may be performed in the on-state to writeinformation into the memory cell. A read operation may be performed inthe off-state to read information from the memory cell.

For example, a programming operation may use signal WL to turn on accesscomponents 311, 411, and 511, and then apply a voltage or a current(e.g., programming voltage or current) through memory elements 333, 444,and 555. The voltage or current can cause at least a portion of thematerial of memory elements 333, 444, and 555 to heat and melt. Afterthe material reaches some temperature (e.g., melting point temperatureof the material), the programming operation may allow the material tocool in a controlled manner, such as by controlling the amplitude andtime interval of a pulse of signal WL used during the programming. Theseheating and cooling actions may change the phase of the material, suchas from a crystalline phase before the programming operation to anamorphous phase after the programming operation. The phase change can bereversible (e.g., changing from an amorphous phase to a crystallinephase). Different phases of the material may cause memory elements 333,444, and 555 to have different resistance states with differentresistance values, which can correspond to different values of theinformation that is being stored in memory elements 333, 444, and 555.

A read operation may use signal WL to turn on access components 311,411, and 511, and then apply a voltage or a current (e.g., read voltageor current) through memory elements 333, 444, and 555. The readoperation may measure the resistance of memory cells 300, 400, and 500based on a read voltage or current to determine the corresponding valueof information stored therein. For example, in each of memory cells 300,400, and 500, a different resistance value can provide a different value(e.g., voltage or current value) on signal BL when a read voltage orcurrent passes through memory elements 333, 444, and 555. Othercircuitry of the memory device (e.g., a circuit such as I/O circuit 116of FIG. 1) can use signal BL to measure the resistance value of memoryelements 333, 444, and 555 to determine the value of the information.

The voltage or current used during a read operation can have a valuedifferent from the voltage or current used during a programmingoperation. For example, in a programming operation in the on-state ofthe memory cell, the value of the signal (e.g., signals from line BL inFIG. 3 or FIG. 4 or from line WL in FIG. 5) that creates a currentflowing through the memory element can be sufficient enough to cause thematerial of at least a portion of the memory element to change betweendifferent phases. The change in phases can alter the resistance value ofthe memory element to reflect the value of the information to be storedin memory elements 333, 444, and 555.

In a read operation in the off-state of the memory cell, the value ofthe signal (e.g., signals from line BL in FIG. 3 or FIG. 4 or from lineWL in FIG. 5) that creates a current flowing through the memory elementcan be sufficient to create the current but insufficient to cause anyportion of the memory element to change between different phases. Thus,the value of the information stored in the memory element can remainunchanged during and after the read operation.

Memory cells 100, 200, 300, 400, and 500 of FIG. 1 through FIG. 5 caninclude a memory cell having a structure similar to or identical to oneor more of the memory cells described below with reference to FIG. 6through FIG. 20.

FIG. 6 through FIG. 9 show a memory cell 600 having a memory element 666configured to have various resistance states 633, 733, 833, and 933corresponding to various resistance values R0, R1, R2, and R3, accordingto various embodiments of the invention. As shown in FIG. 6 through FIG.9, memory cell 600 may include electrodes 651 and 652 coupled to memoryelement 666. Memory cell 600 may also include other components, such asan access component that may be similar to or identical to accesscomponent 211, 311, 411, or 511 (FIG. 2 through FIG. 5).

FIG. 6 through FIG. 9 omit the other components of memory cell 600 tohelp focus on the embodiments discussed herein. Further, for clarity inviewing FIG. 6 through FIG. 9, memory element 666 is shown withcross-section lines (shading lines), and electrodes 651 and 652 areshown without cross-section lines. Electrodes 651 and 652 may correspondto electrodes 351 and 352 (FIG. 3), electrodes 451 and 452 (FIG. 4), orelectrodes 551 and 552 (FIG. 5), which are schematically shown as dotsin FIG. 3 through FIG. 5. Electrode 651 in FIG. 6 through FIG. 9 canhave a solid cylindrical shape.

Memory element 666 may include a variable resistance material that canbe programmed to store information having a value based on theresistance value of the material after programming. The variableresistance material may include a phase change material that may beconfigured to change between multiple phases (e.g., between crystallineand amorphous phases). Some phase change materials may includechalcogenide materials with various combinations of germanium (Ge),antimony (Sb), tellurium (Te), and other similar materials. Examples ofphase change materials may include binary combinations such as germaniumtelluride (GeTe), indium selenide (InSe), antimony telluride (SbTe),gallium antimonide (GaSb), indium antimonide (InSb), arsenic telluride(AsTe), and aluminum telluride (AlTe); ternary combinations such asgermanium antimony telluride (GeSbTe), tellurium germanium arsenide(TeGeAs), indium antimony telluride (InSbTe), tellurium tin selenide(TeSnSe), germanium selenium gallide (GeSeGa), bismuth seleniumantimonide (BiSeSb), gallium selenium telluride (GaSeTe), tin antimonytelluride (SnSbTe), and indium antimony germanide (InSbGe); andquaternary combinations such as tellurium germanium antimony sulfide(TeGeSbS), tellurium germanium tin oxide (TeGeSnO), and alloys oftellurium germanium tin gold, palladium tellurium germanium tin, indiumselenium titanium cobalt, germanium antimony tellurium palladium,germanium antimony tellurium cobalt, antimony tellurium bismuthselenium, silver indium antimony tellurium, germanium antimony seleniumtellurium, germanium tin antimony tellurium, germanium tellurium tinnickel, germanium tellurium tin palladium, and germanium tellurium tinplatinum. Among the phase change materials listed herein, some mayprovide an appropriate choice over the others, depending in part on theapplication of the device. For example, a compound of germanium (Ge),antimony (Sb), and telluride (Te) may be an appropriate choice for aphase change memory device, in part, because of its relatively quickswitching speed (e.g., a few nanoseconds) between different resistancestates. The compound of germanium (Ge), antimony (Sb), and telluride(Te) may have a formula Ge₂Sb₅Te₅. Most of the material compositions inthis description list only the component elements. The relative amountof each component element in each of these material compositions is notlimited to a particular value.

As shown in FIG. 6 through FIG. 9, memory element 666 may have portions601 and 602 directly contact electrodes 651 and 652. FIG. 6 showsportion 602 being located at a general area indicated by a broken circleto indicate that portion 602 can be a part of portion 601 and can expandor contrast. Portion 602 can either occupy the entire volume of portion601 or occupy only a smaller volume that is less than the entire volumeof portion 601. Portion 602 may be referred to as a programmable portion(or programmable volume). A programming operation may program memorycell 600 to one of multiple possible resistance states 633, 733, 833,and 933 corresponding to one of resistance values (in ohm units) R0, R1,R2, and R3. The value of the information stored in memory element 666can be based on which one of resistance values R0, R1, R2, and R3 memoryelement 666 may have after programming.

FIG. 6 shows an example where memory element 666 may have resistancevalue R0 in which the material at portions 601 and 602 has the samecrystalline phase 613. A programming operation may program memory cell600 to cause at least a part of portion 602 to “amorphize” (e.g., changefrom a crystalline phase to an amorphous phase), resulting in anamorphized region 713, 813, or 913, of FIG. 7, FIG. 8, and FIG. 9,respectively.

FIG. 7 through FIG. 9 show amorphized regions 713, 813, and 913 havingdifferent region sizes. For example, amorphized region 713 may have sizesmaller than that of amorphized region 813, and amorphized region 813may have a size smaller than that of amorphized region 913. Differentsizes of the amorphized region of portion 603 may cause memory cell 600to have a different resistance value (e.g., R1, R2, or R3) to representdifferent values of information.

FIG. 10 is a chart 1000 showing example resistance values R0, R1, R2,and R3 and corresponding example resistance values of memory element 666of FIG. 6 through FIG. 9, according to various embodiments of theinvention. Memory cell 600 can be configured to store informationrepresenting a value of multiple bits (e.g., two, three, four, or otherbits). Chart 1000 of FIG. 10 shows an example relationship betweenresistance value and stored information value where each of fourresistance values R0, R1, R2, and R3 can be assigned to a unique valueof four possible values “00”, “01”, “10”, and “11” of two bits. Chart1000 can be stored in a unit of the memory device in different forms,such as firmware, hardware, or other forms.

During a programming operation, depending on what value of informationis to be stored in a memory cell, one of resistance values R0, R1, R2,and R3 can be a target value. For example, if the information value tobe stored in a memory cell is “01” (e.g., provided by a user or byanother device), then the memory device may determine (e.g., based onchart 1000) that resistance value R1 would be a target resistance valueduring programming of that memory cell. In this example, the programmingoperation may apply a signal with one or more programming pulses toprogram the memory element until the programmed resistance value iswithin a target resistance value range of resistance value R1. Each ofresistance values R0, R1, R2, and R3 can have a target resistance valuerange. This range can include a lower limit value equal to the targetresistance value minus a lower offset value and an upper limit valueequal to the target resistance value plus an upper offset value. Thelower and upper offset values can be the same or can be different. Therange of a target resistance value (e.g., the range of R2) does notoverlap with the range of other neighbor target resistance values (e.g.,the ranges of R1 and R3). Non-overlapping ranges allow each range to beunique, so that a unique value of information can correspond to eachrange.

FIG. 11 through FIG. 14 show a memory cell 1100 having a memory element1111 and an access component 1143 arranged in a stack, according tovarious embodiments of the invention. Memory cell 1110 can be configuredto have various resistance states 1133, 1233, 1333, and 1433corresponding to various resistance values R0, R1, R2, and R3. As shownin FIG. 11 through FIG. 14, memory element 1111 is arranged in a stackwith access component 1143 and an additional electrode 1153. Accesscomponent 1143 can include bipolar switching material or other switchingmaterial known to those skilled in the art.

The description herein includes ways to program a memory cell of amemory device, such as memory device 101 or 201 (FIG. 1 or FIG. 2), inwhich the memory device may include a memory cell with a memory elementsuch as memory element 666 (FIG. 6 through FIG. 9) and memory element1111 (FIG. 11 through FIG. 14).

The programming operation may include reset activities (occasionallycalled “reset” or “resetting”) and set activities (occasionally called“set” or “setting”). The reset activities may change the memory cell toa resistance state in which the material of a programmable portion ofthe memory element may have one phase (e.g., an amorphous phase) and thematerial of the other portions of the memory element may have anotherphase (e.g., a crystalline phase).

For example, the reset activity may change memory cell 600 (FIG. 6) fromresistance state 633 corresponding to resistance value R0 to aresistance state 733, 833, or 933 (FIG. 7 through FIG. 9) correspondingto one of resistance values R1, R2, or R3. Thus, each of resistancestates 733, 833, and 933 may be called a “reset” resistance state. Eachof resistance values R1, R2, and R3 may be called a “reset” resistancevalue. Similarly, the reset activity may change memory cell 1100 (FIG.11) from resistance state 1133 corresponding to resistance value R0 to aresistance state 1233, 1333, or 1433 (FIG. 12 through FIG. 14)corresponding to one of resistance values R1, R2, or R3. Thus, each ofresistance states 1233, 1333, and 1433 may be called a “reset”resistance state.

The set activities may change the memory cell from a reset resistancestate to a “set” resistance state at which the material of memoryelement 666 (FIG. 6) or memory element 1111 (FIG. 11) may have the samephase (e.g., crystalline phase), such as a resistance state 633 (FIG. 6)or resistance state 1133 (FIG. 11) corresponding to resistance value R0.Thus, resistance state 633 or resistance state 1133 may be called a“set” resistance state. Resistance value R0 may be called a “set”resistance value.

The reset and set activities of the programming operations describedherein may includes activities of the programming operations describedbelow with reference to FIG. 15 through FIG. 20.

FIG. 15 is a graph of temperature versus time during a programmingoperation to reset a memory cell, such as one of memory cell 100, 200,300, 400, 500, 600, and 1100 of FIG. 1 through FIG. 14, according to anembodiment of the invention. As shown in FIG. 6 through FIG. 9 and FIG.11 through FIG. 14, resistance values R0, R1, R2, and R3 may depend onthe characteristics of the material at the programmable portion (e.g.,portion 602 or 1102) of the memory cell. For example, a different sizeof the amorphized region (e.g., 713, 813, or 913 of FIG. 7 through FIG.9) may result in a different resistance value (e.g., R1, R2, or R3).

As shown in FIG. 15, at time T1 in a programming operation, thetemperature of the material of the programmable portion of the memorycell may start to rise. A programming operation may apply a programmingsignal (e.g., a reset signal in FIG. 16) to heat the programmableportion and cause its temperature to rise.

From time T1 to time T2 in FIG. 15, the temperature of the heatedmaterial at the programmable portion rises and exceeds its crystallinetemperature Tc. From time T2 to time T3, the heated material at theprogrammable portion may melt when it reaches its melting pointtemperature Tm.

From time T3 to time T4, the programming operation may allow thematerial to rapidly cool, such that its temperature may quickly decreasein a manner shown in FIG. 15.

From time T4 to time T5, the programming operation may cause thetemperature of the programmable portion to remain at a relatively hightemperature after the rapid cooling (after time T3). For example, theprogramming operation may cause the temperature of the programmableportion to remain at temperature of at least 200° C. at time T4 andgradually reduce it to a lower temperature (e.g., room temperature) attime T5. As shown in FIG. 4, the temperature at time T4 can berelatively high (e.g., 200° C. or higher) but can be lower than thecrystalline temperature Tc.

After time T5, the material at the programmable portion may amorphizeand become an amorphized region. The size of the amorphized region maydepend on parameter values of a signal used during the programmingoperation. The signal may include one or more pulses. The parametervalues can include an amplitude value of the pulse and values forvarious time intervals for different pulse segments of the pulse.

As is known to those skilled in the art, the reliability of memorydevices with variable resistance memory elements (e.g., phase changememory element) can be related to the metastable nature of the amorphousphase in the material. After programming, the amorphized region thememory element may change over time by a so-called structure relaxation,resulting in long-term resistance drift of the memory element. Forexample, after programming, the resistance of the programmable portionmay increase over time due to structure relaxation. Since the value ofthe information stored in the memory element is based on the value ofthe resistance of the memory element, the resistance drift may changethe value of the information and degrade the reliability of theinformation.

In FIG. 15, maintaining the temperature of the programmable portion at arelatively high temperature (e.g., 200° C. or higher) at time T4 andallowing it to gradually decrease may accelerate the structurerelaxation process and may reduce the long-term resistance drift afterprogramming of the programmable portion. Thus, the reliability of theinformation stored in the memory element may be improved.

FIG. 16 is a graph of amplitude versus time of a signal that can be usedduring the programming operation described above with reference to FIG.15, according to an embodiment of the invention. FIG. 16 shows signal1600 having a single pulse 1601 as an example. Signal 1600 may includemultiple pulses during a programming of a memory cell. The multiplepulses can have the different amplitude values.

Amplitude values Y_(RESET1), Y_(RESET2), Y_(RESET3), and Y_(RESET4)correspond to different values of the amplitude of pulse 1601 withY_(RESET3) being the greatest value. Amplitude values Y_(RESET3) canalso be called the peak amplitude value of pulse 1601. Amplitude valuesY_(RESET1) and Y_(RESET4) can be the same and can include zero. Signal1600 can include a voltage signal or a current signal. Thus, amplitudevalues Y_(RESET1), Y_(RESET2), Y_(RESET3), and Y_(RESET4) can be voltageor current values. Different amplitude values of Y_(RESET3) can cause aprogrammable portion of a memory cell to amorphize to differentamorphized regions with different sizes corresponding to differentresistance values (e.g., R1, R2, and R3). For example, one value ofY_(RESET3) can cause the memory cell to have one resistance value (e.g.,R1) and another value of one value of Y_(RESET3) can cause the memorycell to have another resistance value (e.g., R2).

As shown in FIG. 16, pulse 1601 has a non-square shape and has multiplepulse segments with different slopes at different time intervals. Forexample, at time interval 1611 (from time T1 to time T2), pulse 1601 hasa pulse segment 1621 with a positive slope. At time interval 1612 (fromtime T2 and to time T3), pulse 1601 has pulse segment 1622 with slope ofapproximately zero (e.g., substantially flat). At time interval 1613(from time T3 to time T4), pulse 1601 has a pulse segment 1623 with anegative slope. At time interval 1614 (from time T4 to time T5), pulse1601 has a pulse segment 1624 with another negative slope.

The slope of pulse segment 1623 can be substantially greater (e.g.,steeper) than the slope of pulse segment 1624. The absolute value of theslope of pulse segment 1623 can be greater than the absolute value ofthe slope of each of pulse segment 1621 and pulse segment 1622. Theabsolute value of pulse segment 1622 can be less than the absolute valueof each of pulse segment 1621 and pulse segment 1623. The absolute valueof the slope of pulse segment 1624 can be less than the absolute valueof each of pulse segment 1621 and pulse segment 1622.

During a programming operation, at an appropriate amplitude value ofY_(RESET3), time interval 1611 can be at sufficient value to heat theprogrammable portion (e.g., 602 in FIG. 6 or 1102 in FIG. 11) such thatthe material of the heated programmable portion can reach at least itsmelting point temperature Tm. For example, when the material of theprogrammable portion includes a phase change material, time interval1611 can have value in the range of 10 nanoseconds (ns) to 20 ns. Otherranges can be used.

Time interval 1612 can be at a sufficient value to allow the material ofthe programmable portion to change from one phase to another phase, suchas from a crystalline phase to an amorphous phase for a phase changematerial. For example, time interval 1612 can have a value the range of30 ns to 50 ns. Other ranges can be used.

After the programmable portion reaches its melting point temperature Tmfor a time interval 1612, the programming operation may quickly decreasethe value of the amplitude of pulse 1601 to allow rapid cooling(sometimes referred to as quick quenching) of the programmable portion.As shown in FIG. 16, the amplitude of pulse 1601 can be decreased fromamplitude value Y_(RESET3) at time T3 to amplitude value Y_(RESET2) attime T4 in a relatively small time interval 1613. Time interval 1613 canbe at least five times less than time interval 1612. For example, timeinterval 1613 can have a value in the range of a fraction of onenanosecond (e.g., near zero) to 5 ns. Other ranges can be used.

Pulse segment 1624 at time interval 1614 in FIG. 16 can maintain thetemperature of at least a portion (e.g., programmable portion) of thememory element at a relatively high temperature (e.g., 200° C. orhigher) at time T4 and gradually decrease it to a lower temperature(e.g., room temperature) at the end of the programming of the memorycell (e.g., at time T5). The rate at which pulse segment 1624 decreasesthe temperature of the portion (e.g., programmable portion) of thememory element can be lower than the rate at which pulse segment 1623decreases the temperature of the portion of the memory element.

As is known to those skilled in the art, after programming, theprogrammed resistance value (e.g., R1, R2, or R3 in FIG. 6 through FIG.9) may change over time. Thus, the value of the informationcorresponding to the programmed resistance value may no longer reflectthe original value of the stored information. As described above withreference to FIG. 15, the change in resistance value can be attributedin part to a resistance drift due to structure relaxation in thematerial of the memory element during and after programming of thememory element. The structure relaxation involves a change in theproperties of the material over time. Applying a signal, such as signal1600 in FIG. 16, may accelerate the structure relaxation by causing thestructure relaxation to occur mostly during programming (e.g., occurbetween times T4 and T5). Thus, after programming (e.g., after time T5),the structure relaxation can be reduced, thereby reducing the resistancedrift after programming. A reduction in the resistance drift afterprogramming may allow the programmed resistance value (e.g., R1, R2, orR3) to remain unchanged or to stay at a relative constant value, therebyimproving the reliability of the information stored in the memoryelement and potentially reducing the process of error-correction of thestored information.

As shown in FIG. 16, instead of quickly decreasing the amplitude ofpulse 1601 from amplitude value Y_(RESET2) at time T3 to amplitude valueY_(RESET4) (which can be equal to Y_(RESET1)) at some time before timeT5 (e.g., time T4), signal 1600 may gradually decrease the amplitude ofpulse 1601 from amplitude value Y_(RESET2) at time T4 to amplitude valueY_(RESET4) at time T5. Time interval 1614 can be at least ten timesgreater than time interval 1613. Time interval 1614 can also be at leasttwo times greater than time interval 1611. For example, time interval1614 can have value in the range of 50 ns to 200 ns.

The gradual decrease in the pulse amplitude value during time interval1614 (from time T4 to time T5) can cause the temperature of aprogrammable portion of a memory element to gradually decrease from ahigher temperature (e.g., 200° C.) at time T4 to a lower temperature(e.g. room temperature) at time T5. The gradually decrease in thetemperature resulted from the pulse amplitude value being graduallydecreased can accelerate the structure relaxation process to improve thereliability of the information stored in the memory element.

The acceleration of the structure relaxation may be dependent ontemperature, such as inversely proportional to temperature. As describedabove with reference to FIG. 15, maintaining the temperature of at leasta portion of the memory element at a relatively high temperature (e.g.,200° C. or higher) right after cooling may accelerate the structurerelaxation. A higher temperature may lead to a shorter structurerelaxation time. A lower temperature may lead to a longer structurerelaxation time. In some cases, the structure relaxation time can beapproximately tens of nanoseconds when the temperature of theprogrammable portion of memory element is approximately 200° C. (orhigher) at time T4.

The temperature that can be maintained at a time after cooling (e.g., attime T4) can be proportional to the amplitude value (e.g., Y_(RESET2) inFIG. 16) of the pulse at that time (e.g., at time T4). For example, arelatively higher amplitude value of Y_(RESET2) at time T4 can maintainthe temperature at time T4 at a higher temperature (e.g., 210° C.). Arelatively lower amplitude value of Y_(RESET2) at time T4 can maintainthe temperature at time T4 at a lower temperature (e.g., 200° C.). Asdescribed above, a higher temperature may lead to a shorter structurerelaxation time. Thus, a higher temperature at time T4 due to a higheramplitude value of Y_(RESET2) at time T4 can shorten the structurerelaxation time and time interval 1614, leading to a reduction in theoverall programming time. For example, at an appropriate amplitude valueof Y_(RESET2,) the programming time can be less than 100 ns.

Amplitude value Y_(RESET2) in FIG. 16 depends on amplitude valueY_(RESET3) (e.g., amplitude value before rapid cooling). Amplitude valueY_(RESET3) can be related to dimensions and material properties of thememory cell. For example, amplitude value Y_(RESET3) can be at least oneand a half (1.5) times greater than amplitude value Y_(RESET2.) In somecases, when a memory cell having a phase change memory element and anelectrode (e.g., electrode 651 in FIG. 6) with a diameter ofapproximately 35 nm, amplitude value Y_(RESET2) can be approximately 2.2volts and amplitude value Y_(RESET3) can be approximately 3.5 volts,where 3.5 volts can be the peak voltage of signal 1600 during timeinterval 1612 (e.g., before the rapid cooling during time interval1613).

The values of the amplitudes (e.g., Y_(RESET1), Y_(RESET2), Y_(RESET3),and Y_(RESET4)) and the values of time intervals (e.g., 1611, 1612,1613, and 1614) can be stored in form of a table, such as table 155 inFIG. 1, of a memory device. Alternatively or in addition, these valuescan also be generated by hard wired circuit elements included in thememory device. These circuit elements may include adjustable circuitelements to appropriately adjust the values of the amplitudes, timeintervals, or both. Examples of the adjustable circuit elements includefuses and antifuses. The amplitude values, time values, or both can beselected by appropriate arranging connections (e.g., duringmanufacturing) of such fuses or antifuses.

Accelerated structure relaxation as described above can improve (e.g.,by broadening) the switch window of the memory cell. The switch windowrefers to a window when the memory cell switches between “reset”resistance state with maximum resistance value and “set” resistancestate with minimum resistance value. For example, as is known to thoseskilled in the art, the programmed resistance value and the thresholdvoltage value of the memory cell have a linear relationship. An increasein a programmed resistance value leads to an increase threshold voltagevalue. The accelerated structure relaxation may increase the programmedresistance value in the “reset” resistance state. Thus, the thresholdvoltage value in the “reset” resistance state also may also increase,thereby broadening the switch window of the memory cell. Further, anincrease in the switch window, due to the threshold voltage value in the“reset” resistance state being increased, may not affect read signals(e.g., voltage or current) used to read the memory during a readoperation. Thus, adjustments to components (e.g., read circuitry) of thememory device may be avoided.

Some phase change memory devices, (e.g., Ovonic Threshold Switch (OTS)or others) may estimate design calculation based on a threshold voltageassociated with the programmed resistance value of the memory cell.Without the accelerated structure relaxation described above, the designlatitude may be suitable right after programming because the thresholdvoltage most likely remains stable due to the programmed resistancevalue remaining unchanged right after the programming. However, theprogrammed resistance value may drift (e.g., change to a higher value)over time. Thus, the design latitude may be invalid. Using a programmingoperation with the accelerated structure relaxation described above, theprogrammed resistance value may remain relatively unchanged over time.Therefore, threshold voltage associated with the programmed resistancevalue may remain relatively unchanged over time. Thus, when thethreshold voltage in the programming operation with acceleratedstructure relaxation is used in the design calculation in some memorydevices, overestimation of the design calculation may be avoided.

The description above with respect to FIG. 15 and FIG. 16 refers to aprogramming operation to reset a memory cell, such as to program thememory element to a particular resistance value (e.g., R1, R2, or R3).The programming operation may also set the memory element, such as toprogram the memory element to an initial resistance value (e.g., R0).

FIG. 17 is a graph of temperature versus time during a programmingoperation to set a memory element of a memory cell, such as the memorycells 100, 200, 300, 400, 500, 600, and 1100 of FIG. 1 through FIG. 14,according to an embodiment of the invention.

As shown in FIG. 17, at time T6 in a programming operation, thetemperature of the material of the programmable portion of the memorycell may start to rise. A programming operation may apply a programmingsignal (e.g., a set signal in FIG. 18) to heat the programmable portionand cause its temperature to rise.

From time T6 to time T7, the temperature of the heated material at theprogrammable portion rises and exceeds its crystalline temperature Tcbut stays below its melting point temperature Tm.

From time T7 to time T8, the programming operation may cause thematerial at the programmable portion to remain at a relatively constanttemperature.

From time T7 to time T8, the programming operation may allow thetemperature of material at the programmable portion to decrease. As aresult, the programmable portion may “recrystallize” (e.g., change froman amorphous phase to a crystalline phase) such that the material of theprogrammable portion and other portions (e.g., portions 602 and 601 inFIG. 7 through FIG. 9) may have the same phase. After time T9, thememory cell may have a resistance value (e.g., resistance value R0 inFIG. 6) corresponding to a crystalline phase of the material.

FIG. 18 is a graph of amplitude versus time of signal 1800 that can beused during the programming operation associated with FIG. 17, accordingto an embodiment of the invention. FIG. 18 shows signal 1800 having asingle pulse 1801 as an example. Signal 1800 may include multiple pulsesduring a programming of a memory cell. The multiple pulses can have thesame amplitude value.

Amplitude values Y_(SET1), Y_(SET2), and Y_(SET3) correspond todifferent values of the amplitude of pulse 1801. Amplitude valuesY_(SET1) and Y_(SET3) can be the same and can include zero. Signal 1800can include a voltage signal or a current signal. Thus, amplitude valuesY_(SET1), Y_(SET2), and Y_(SET3) can be voltage or current values.

As shown in FIG. 18, pulse 1801 has a non-square shape and has multiplepulse segments with different slopes at different time intervals. Forexample, at time interval 1811 (from time T6 to time T7), pulse 1801 hasa pulse segment 1821 with a positive slope. At time interval 1812 (fromtime T7 and to time T8), pulse 1801 has pulse segment 1822 with a slopeof approximate zero (e.g., substantially flat). At time interval 1813(from time T8 to time T9), pulse 1801 has a pulse segment 1823 with anegative slope.

As shown in FIG. 18, the absolute value of the slope of pulse segment1821 can be greater than the absolute value of the slope of each ofpulse segment 1822 and pulse segment 1823.

During a programming operation, with an appropriate amplitude value ofY_(SET2), time interval 1811 can be at sufficient value to allow heatingof the programmable portion (e.g., 601 in FIG. 6 or 1102 in FIG. 11)such that the temperature of the material of the heated programmableportion can rise above crystalline temperature Tc but stay below itsmelting point temperature Tm. For example, time interval 1811 can havevalue in the range of 10 ns to 20 ns.

With an appropriate amplitude value of Y_(SET2), time interval 1812 canbe at a sufficient value to allow the material of the programmableportion to change from one phase to another phase, such as from anamorphous phase to a crystalline phase for a phase change material. Forexample, time interval 1812 can have a value the range of 50 ns to 100ns.

After the programmable portion reaches its melting crystallinetemperature Tc for time interval 1812, the programming operation maygradually decrease the value of the amplitude of pulse 1801 to allow thetemperature of the programmable portion to gradually decrease. As shownin FIG. 18, the amplitude of pulse 1801 can be gradually decreased fromamplitude value Y_(SET2) to amplitude value Y_(SET3). The time interval1813 can be relatively large. For example, time interval 1813 can have avalue in the range of 100 ns 150 ns.

The values of the amplitudes (e.g., Y_(SET1), Y_(SET2), and Y_(SET3))and the values of time intervals (e.g., 1811, 1812, and 1813) can bestored in form of a table, such as table 155 in FIG. 1, of a memorydevice. Alteratively or in addition, these values can also be generatedby hard wired circuit elements included in the memory device. Thesecircuit elements may include adjustable circuit elements toappropriately adjust the values of the amplitudes, time intervals, orboth. Examples of the adjustable circuit elements include fuses andantifuses. The amplitude values, time values, or both can be selected byappropriate arranging connections (e.g., during manufacturing) of suchfuses or antifuses.

FIG. 19 is a graph showing a signal 1900 having multiple pulses usedduring a programming operation, according to an embodiment of theinvention. Signal 1900 can include pulses 1901, 1902, and 1903, whichhave a pulse shape similar to the non-square shape of pulse 1801 in FIG.18. Signal 1900 in FIG. 19 can also include pulses 1911, 1912, and 1913,which have a pulse shape similar to the non-square shape of pulse 1601in FIG. 16. As shown in FIG. 19, signal 1900 has different amplitudevalues Y_(SET2), Y_(RESET3), Y_(RESET5), and Y_(RESET6) correspondingtheir respective pulses. Amplitude values Y_(RESET3), Y_(RESET5), andY_(RESET6) can be peak amplitude values of pulses 1911, 1912, and 1913,respectively. A programming operation may apply (e.g., serially apply)some or all of these pulses of signal 1900 to program a memory celluntil a programmed resistance value in that memory cell is within atarget resistance value range of a corresponding target resistance value(e.g., R1, R2, or R3 in FIG. 6 through FIG. 14).

In the description with reference to FIG. 19, resistance value R1 isused as an example target resistance value to be programmed into amemory cell. R_(PRG.A), R_(PRG.B), and R_(PRG.C) in FIG. 19 representvarious programmed resistance values measured from the memory cell afterone or more pulses of signal applied during the programming operation.In this example, programmed resistance value R_(PRG.C) is the onlyprogrammed resistance value that is within the target resistance valuerange. Each of the programmed resistance values R_(PRG.A) and R_(PRG.B)is outside the target resistance value range. During a programmingoperation, if the measured programmed resistance value (R_(PRG.A) orR_(PRG.B)) is outside a target resistance value range, the programmingoperation may continue (e.g., with one or more different pulses) untilthe measured programmed resistance value (R_(PRG.C)) is within thetarget resistance value. The programming operation may stop programmingthe memory cell when the measured programmed resistance value in thememory cell is within the target resistance value range.

As shown in FIG. 19, the programming operation may initially apply pulse1901 to program (e.g., set) the memory cell to an initial resistancevalue R0. Then, the programming operation may apply pulse 1911 toprogram (e.g., reset) the memory cell to programmed resistance valueR_(PRG.A.) After determining that programmed resistance value R_(PRG.A)is outside the target resistance value range, the programming operationmay repeat the programming with one or more of pulses 1902, 1912, 1903,and 1913. Determining whether a programmed resistance value is within atarget resistance value range can include measuring the programmedresistance value and comparing it with a lower limit value and an upperlimit value of the target resistance value range. The comparison caninclude determining a condition of whether the programmed resistancevalue is at least equal to the lower limit value and, at most, equal tothe upper limit value. If this condition is unsatisfied, the programmingoperation may repeat the programming until the condition is satisfied,such that the programmed resistance value (e.g., R_(PRG.C)) is withinthe target resistance value range.

As shown in FIG. 19, pulses 1911, 1912, and 1913 can have amplitudeswith different values Y_(RESET3), Y_(RESET5), and Y_(RESET6). Thedifferent amplitudes values may allow the programming operation tochange from one programmed resistance value to a different resistancevalue after each of pulses 1911, 1912, and 1913, so that the programmedresistance value can eventually be within the target resistance valuerange.

The programming operation may use pulses 1901, 1902, and 1903 to program(e.g., set) the memory cell to an initial resistance value (e.g., R0)before each time that the programming operation programs (e.g., resets)the memory cell to a programmed resistance value R_(PRG.A), R_(PRG.B) orR_(PRG.C). Pulses 1901, 1902, and 1903 can have an amplitude with thesame amplitude value (e.g., Y_(SET2)) and it can remain unchanged (e.g.,at Y_(SET2)) each time programming the memory cell is repeated. Usingpulse 1901, 1902, or 1903 to set the memory cell before the memory cellis reset each time may allow the memory cell to have a consistentinitial resistance value (e.g., R0) to improve the programmingoperation.

FIG. 20 shows a flow diagram for a method 2000 of programming a memorydevice, according to an embodiment of the invention. Method 2000 can beused to program the memory cells described above with reference to FIG.2 through FIG. 19. Thus, method 2000 can include activities andprogramming operations described above with reference to FIG. 2 throughFIG. 19.

Method 2000 can include activities 2010, 2020, and 2030 duringprogramming a memory cell. Activity 2010 may apply a signal to program amemory cell. The signal may include signal 1900 of FIG. 19. Activity2020 of method 2000 may determine whether a programmed resistance valueof the memory cell is within a target resistance value range. If theprogrammed resistance value is within the target resistance value range(indicated by “YES” in FIG. 20), method 2000 may stop programming thememory cell, and the programming of that memory cell is finished. If theprogrammed resistance value is outside the target resistance value range(indicated by “NO” in FIG. 20), method 2000 may continue with activity2030.

Activity 2030 may adjust the signal and continue programming the memorycell until the programmed resistance value of the memory cell is withinthe target resistance value range. Activity 2030 may adjust the signalby changing the value of the amplitude of a pulse of the signal. Method2000 can include additional activities and programming operationsdescribed above with reference to FIG. 2 through FIG. 19.

The illustrations of apparatus (e.g., memory device 100 of FIG. 1 andmemory cells of FIG. 2 through FIG. 14) are intended to provide ageneral understanding of the structure of various embodiments and arenot intended to provide a complete description of all the elements andfeatures of apparatus or systems that might make use of the structuresdescribed herein.

Any of the components described above can be implemented in a number ofways, including simulation via software. Thus, the apparatus (e.g.,memory device 100 and its components) described above may all becharacterized as “modules” (or “module”) herein. Such modules mayinclude or be included in hardware circuitry, single and/ormulti-processor circuits, memory circuits, software program modules andobjects and/or firmware, and combinations thereof, as desired by thearchitect of the apparatus (e.g., memory device 100) and as appropriatefor particular implementations of various embodiments. For example, suchmodules may be included in a system operation simulation package, suchas a software electrical signal simulation package, a power usage anddistribution simulation package, a capacitance-inductance simulationpackage, a power/heat dissipation simulation package, a signaltransmission-reception simulation package, and/or a combination ofsoftware and hardware used to operate or simulate the operation ofvarious potential embodiments.

The apparatus of various embodiments may include or be included inelectronic circuitry used in high-speed computers, communication andsignal processing circuitry, single or multi-processor modules, singleor multiple embedded processors, multi-core processors, data switches,and application-specific modules including multilayer, multi-chipmodules. Such apparatus may further be included as sub-components withina variety of electronic systems, such as televisions, cellulartelephones, personal computers (e.g., laptop computers, desktopcomputers, handheld computers, tablet computers, etc.), workstations,radios, video players, audio players (e.g., MP3 (Motion Picture ExpertsGroup, Audio Layer 3) players), vehicles, medical devices (e.g., heartmonitor, blood pressure monitor, etc.), set top boxes, and others.

The embodiments described above with reference to FIG. 1 through FIG. 20include a device having memory elements and methods of storinginformation into the memory elements. Such methods can includeincreasing a temperature of a portion of a memory element for a timeinterval during an operation to change a resistance state of the memoryelement. After the time interval, the methods can include decreasing thetemperature of the portion of the memory element. Decreasing thetemperature can be performed using a signal having a first negativeslope and a second negative slope. Other embodiments are described abovewith reference to FIG. 1 through FIG. 20.

The above description and the drawings illustrate some embodiments ofthe invention to enable those skilled in the art to practice theembodiments of the invention. Other embodiments may incorporatestructural, logical, electrical, process, and other changes. Examplesmerely typify possible variations. Portions and features of someembodiments may be included in, or substituted for, those of others.Many other embodiments will be apparent to those of skill in the artupon reading and understanding the above description.

What is claimed is:
 1. A method comprising: increasing a temperature ofa portion of a memory element for a time interval during an operation tochange a resistance state of the memory element; decreasing thetemperature of the portion of the memory element after the timeinterval, wherein decreasing the temperature is performed using a signalhaving a first negative slope and a second negative slope; and repeatingthe increasing and decreasing the temperatures the portion of the memoryelement if the resistance state of the memory element is outside atarget resistance value range, wherein the signal has a differentamplitude value if the increasing and decreasing the temperatures isrepeated.
 2. The method of claim 1, wherein increasing the temperatureand decreasing the temperature is performed using a single pulse of thesignal.
 3. The method of claim 2, wherein the single pulse includes afirst pulse segment with a positive slope, a second pulse segment withthe first negative slope, and a third pulse segment with the secondnegative slope, and wherein increasing the temperature is performedduring a time interval associated with the first pulse segment.
 4. Themethod of claim 1, wherein the first negative slope is greater than thesecond negative slope.
 5. The method of claim 1, wherein the firstnegative slope is associated with a first time interval during theoperation, the second negative slope is associated with a second timeinterval during the operation, and the second time interval is at leastten times greater than the first time interval.
 6. The method of claim5, wherein the second time interval has a range of 50 nanoseconds to 200nanoseconds.
 7. The method of claim 1, wherein decreasing thetemperature of the portion of the memory element is performed after amaterial of the portion of the memory element reaches a melting pointtemperature of the material.
 8. The method of claim 1, wherein the firstnegative slope occurs when the temperature of the portion of the memoryelement is at least 200° C.
 9. A method comprising: increasing atemperature of a portion of a memory element during an operation tochange a resistance state of the memory element; decreasing thetemperature, at a first rate, to a temperature below a melting pointtemperature of a material of the portion of the memory element after thetemperature reaches a melting point temperature of the material;decreasing the temperature a second rate lower than the first rate toaccelerate structure relaxation of the memory element; and repeating theincreasing and decreasing the temperatures of the portion of a memoryelement if the resistance state of the memory element is outside atarget resistance value range, wherein the signal has a differentamplitude value if the increasing and decreasing the temperatures isrepeated.
 10. The method of claim 9, wherein decreasing the temperatureat the first rate is performed during a first segment of a pulse, anddecreasing the temperature at the second rate is performed during asecond segment of the pulse.
 11. The method of claim 9, whereinincreasing the temperature is performed during a first time intervalthat is at least two times less than a time interval when thetemperature is decreased at the second rate.
 12. A method comprising:changing a first amplitude value of a first pulse of a signal to asecond amplitude value in a first time interval during an operation tostore information into a memory cell; changing the second amplitudevalue to a third amplitude value in a second time interval during theoperation; changing the third amplitude value to a fourth amplitudevalue in a third time interval during the operation, wherein the signalhas a first slope during the second time interval and a second slopeduring the third time interval, and the second slope is different fromthe first slope and repeating the operation to store information intothe memory cell using a second pulse of the signal if a resistance valueof the memory cell is outside a target resistance value range after thefirst, second, and third amplitudes of the first pulse are changed,wherein the first and second pulses have different amplitude values. 13.The method of claim 12, wherein the second amplitude value is greaterthan each of the first amplitude value and third amplitude value. 14.The method of claim 12, wherein the second amplitude value is at leastone and a half times greater than the third amplitude value.
 15. Themethod of claim 12, wherein the first amplitude value is equal to thefourth amplitude value.
 16. The method of claim 15, wherein the firstamplitude value is zero.
 17. A method comprising: programming a memorycell using a pulse to cause the memory cell to have a programmedresistance value, the pulse including multiple negative slopes; andrepeating the programming if the programmed resistance value is outsidea target resistance value range, wherein the pulse has a differentamplitude value each time the programming is repeated.
 18. The method ofclaim 17, wherein programming the memory cell further includes: using anadditional pulse to cause the memory cell to have an initial resistancevalue different from the programmed resistance value.
 19. The method ofclaim 17, wherein repeating the programming further includes using anadditional pulse in addition to the pulse used to cause the memory cellto have the programmed resistance value, wherein the additional pulseincludes an amplitude value less than the amplitude value of the pulseused to cause the memory cell to have the programmed resistance value.20. The method of claim 19, wherein an amplitude value of the additionalpulse remains unchanged each time the programming is repeated.
 21. Amemory device comprising: a memory element; and a module to apply asignal to change a state of the memory element, the signal including apulse, the pulse having a first pulse segment with a positive slope, asecond pulse segment with a first negative slope, and a third pulsesegment with a second negative slope, the module further to apply anadditional pulse of the signal to change the state of the memory elementif a resistance value of the memory element is outside a targetresistance value range after the pulse is applied, wherein the pulse andthe additional pulse have different amplitude values.
 22. The memorydevice of claim 21, wherein an absolute value of the first negativeslope is greater than an absolute value of the second negative slope.23. The memory device of claim 22, wherein the absolute value of thesecond negative slope is less than an absolute value of the positiveslope.
 24. The memory device of claim 21, wherein the pulse includes anadditional pulse segment between the first pulse segment and the secondpulse segment.
 25. The memory device of claim 24, wherein an absolutevalue of the additional pulse segment is less than an absolute value ofeach of the first pulse segment and the second pulse segment.
 26. Thememory device of claim 21, wherein the resistance value includes aresistance value of a material of the memory element.
 27. The memorydevice of claim 21, wherein the memory element includes a phase changematerial.
 28. A memory device comprising: a memory element having amaterial; and a module to apply a pulse to store information into thememory element, the module to increase an amplitude value of the pulsefrom a first amplitude value to a second amplitude value during aheating of the memory element, to decrease the second amplitude value toa third amplitude value during a cooling of the memory element, and todecrease the third amplitude value to a fourth amplitude after thecooling of the memory element, the module further to apply an additionalpulse if a resistance value of the memory element is outside a targetresistance value range after the pulse is applied, wherein the pulse andthe additional pulse have different amplitude values.
 29. The memorydevice of claim 28, wherein the second amplitude value has a range ofapproximately 3 volts to approximately 4 volts.
 30. The memory device ofclaim 29, wherein the third amplitude value has a range of approximately2 volts to approximately 2.5 volts.
 31. The memory device of claim 30,wherein the memory element is coupled to an electrode and the electrodehas a cylindrical shape.
 32. The memory device of claim 28, furthercomprising an access component arranged in a stack arrangement with thememory element.
 33. The memory device of claim 32, further comprising anelectrode between the memory element and the access component.